Artículo: AMZ-B084G5D2SJ

Focket

BGA Stencil Reballing Holder Station Kit,Aluminum Alloy Universal BGA Reballing Station Solder Rework Kit with Handles+Stencils+Balls Kit

Detalles del producto
Disponibilidad
En stock
Peso con empaque
1.08 kg
Devolución
Si
Condición
Nuevo
Producto de
Amazon
Viaja desde
USA

Sobre este producto
  • Features: Aluminum alloy structure, the structure is light and . The upper cover has a which is convenient for removal of excess tin balls. One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50*50mm. BGA chip secedes steel stencils size is 90*90mm. Specifications: Material: Aluminum alloy Tin Balls Size: 0.76mm, 0.6mm, 0.5mm, 0.45mm Weight: 635g(approx.) Package Includes: 1 x BGA Reballing Station with Handles(90*90mm) 9 x Steel Stencils 4 Bottles x Tin Balls (0.76mm, 0.6mm, 0.5mm, 0.45mm) 1 x Desoldering Wick 1 x Brush 1 x Tap 1 x Tn Shaving Pen 1 x Hex Key
₡ 38,800

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Aluminum alloy structure, the structure is light and . The upper cover has a which is convenient for removal of excess tin balls. One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50*50mm. BGA chip secedes steel stencils size is 90*90mm.