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Artículo: AMZ-B0B68JWZRZ
Newzoll
130Pcs Universal Directly Heat BGA Reballing Net Stencils Templates Kit for Soldering Accessories Adopt 304 Stainless Steel Plate.
Detalles del producto
Disponibilidad
En stock
En stock
Peso con empaque
0.36 kg
0.36 kg
Devolución
Si
Si
Condición
Nuevo
Nuevo
Producto de
Amazon
Amazon
Viaja desde
USA
USA
Sobre este producto
- Features: These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate. Can be heated by the hot air machine, these stencils are not easy to deform when heated. Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform. The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is not applicable. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering. Specifications: Material: 304 stainless steel Color: as shown Stencils specifications: as the picture Quantity: 130PCS/Set Package Included: 130 x Universal Stencils Important tips: 1. Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%). 2. Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%). 3. Some good solder ball and silver is normal. Melting point is normal. 4.When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.
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These stencils were made of high quality 304 stainless steel plate, the thickness of steel mesh is appropriate Can be heated by the hot air machine, these stencils are not easy to deform when heated Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform. The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
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