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Artículo: AMZ-B0F1K9JD6S
ZXKLXYY
ZXKLXYY Computer Motherboards Fit for GIGABYTE GA-Z77-DS3H Desktop Motherboard LGA1155 DDR3 32GB PCI-E 3.0 Support Core I7i5i3 CPUs USB2.0 ATX Placa-mãe
Detalles del producto
Disponibilidad
En stock
En stock
Peso con empaque
1.20 kg
1.20 kg
Devolución
No
No
Condición
Nuevo
Nuevo
Producto de
Amazon
Amazon
Viaja desde
USA
USA
Sobre este producto
- this motherboards helps users work smarter by delivering an efficient and productive experience. Featuring stable functionality and high-quality assembly, motherboards provide not only optimized professional workflows but also less troubleshooting and longevity. Motherboard chip Integrated chip sound card/network card Main chipset Z77 Chipset description Using Z77 chipset Display chip CPU built-in display chip (requires CPU support) Audio chip integrated Realtek ALC887 8-channel audio chip Network card chip onboard Atheros AR8151 Gigabit network card Processor specifications CPU type Core i7/Core i5/Core i3/Pentium/Celeron CPU socket LGA 1155 CPU description Support 22nm processor Memory specifications Memory type 4×DDR3 DIMM Maximum memory capacity 32GB Memory description Support dual-channel DDR3 2800 (overclocking)/1600/1333/1066MHz memory Storage expansion PCI-E standard PCI-E 3.0 standard PCI-E slot 2×PCI-E X16 graphics card slot, 2×PCI-E X1 slot PCI slot 2 × PCI slot Storage interface 3×SATA II interface; 2×SATA III interface I/O interface USB interface 8 × USB2.0 interface (4 built-in + 4 backplane); 4 × USB3.0 interface (2 built-in + 2 backplane) Video interface 1×DVI interface, 1×VGA interface, 1×HDMI interface Power connector One 8-pin, one 24-pin power connector Other interfaces 1×RJ45 network interface, audio interface, PS/2 keyboard and mouse universal interface Board type Motherboard board type ATX board type Dimensions 30.5×21.5cm
₡ 81,939
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₡ 81,939
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this motherboards come with upgraded power design, high grade storage standards, and outstanding connectivity that enables you to optimize your performance. Made of high quality materials, stable and high performance，durable. Core boost : with premium layout and optimized power design to support more Cores and provide better performance. Boosted Memory Performance: Careful routing of traces and vias, plus ground layer optimizations to preserve signal integrity for improved memory overclocking . Built to strict quality control standards,design improved for more durability. Comprehensive thermal design: Passive chipset heatsink, aluminum heatsinks .
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